The Micro/Nano Fabrication Center at the University of Arizona
 

 

372

Fully automated, single wafer Chemical Mechanical Planarizer polishing
system designed to accommodate 100mm to 200mm wafers.

Features automatic wafer loading/unloading, and is capable of two-step
polishing processing to maximize wafer processing capability and quality

Includes Entrepix advanced pad profiler pad conditioner

   Suitable for
   * CMP processing of oxide and other dielectrics, tungsten and copper
   * Silicon and SOI polishing
   * MEMS processing
   * R&D and high volume manufacturing

 

University of Arizona | College of Engineering | 1230 E. Speedway Blvd. | Tucson, AZ 85721-0104
Phone: 520-621-3380 | Fax: 520-621-8881 | contact us
 
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