The Micro/Nano Fabrication Center at the University of Arizona
 

 

AGS Reactive Ion Etcher (RIE) System

This system is capable of plasma etching and plasma cleaning substrates that are as large as 300mm (12") in diameter. Films that can be etched include silicon nitride, silicon dioxide, poly silicon, and photo resist.
University of Arizona | College of Engineering | 1230 E. Speedway Blvd. | Tucson, AZ 85721-0104
Phone: 520-621-3380 | Fax: 520-621-8881 | contact us
  
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