The Micro/Nano Fabrication Center at the University of Arizona


AGS Reactive Ion Etcher (RIE) System

Located in our Cleanroom this system is capable of plasma etching and plasma cleaning substrates as large as 300mm (12") in diameter. It can etch silicon nitride, silicon dioxide, poly silicon, germanium and polymers. It can clean and remove photoresists and organic residues.

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University of Arizona | Arizona Research Labs | 1230 E. Speedway Blvd. | Tucson, AZ 85721-0104
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