COBILT SPINNER INSTRUCTIONS

This machine is to be used by authorized personnel only. For training contact the MFC Engineer in office # 201E phone 621-9849.

Enter all necessary information in the Log Book for each use.

1. Verify that the spinner is turned on.

2. Fill in the Log Book located near the Spinner

3. Select wafer chuck according to the size wafer you will be coating and push that chuck onto the spindle.

4. Place your wafer on the wafer chuck (try to center the wafer on the chuck) and press the vacuum button

5. Press the start button to verify the wafer is centered on the chuck. If it is not centered release the vacuum and center the wafer. Repeat until the wafer is properly centered.

6. Make sure the wafer is vacuumed securely.

7. To set your desired speeds and times press the start button. As soon as you press start the machine will begin spinning. Our standard program (using AZ 3315 and AZ 1512 photoresist) consists of a deposit speed of 1000 RPM for approx. 4 seconds, and a spread speed of 4000 RPM for 10 – 30 seconds

2 knobs on the front of the control panel are used to set speeds

2 knobs on the front of the control panel are used to set times

One of the knobs is labeled with a D (deposit) and one with an S (spread). These are the speed dials. Adjust the deposit and spread speeds to suit your needs with these dials. Directly below both of these knobs are the time setting knobs for each speed so you can set your desired spin times.

8. Check the digital temperature and humidity meter on the wall to the left of the spinner. If the HUMIDITY is 50% or greater it is necessary to spin HMDS onto the wafer prior to the photoresist. Obtain a clean pipette and withdraw a few drops of HMDS from the bottle press the start button and squeeze the HMDS onto the center of the wafer. It will spread and evaporate immediately. If HMDS is not used when the humidity is high the photoresist WILL NOT develop correctly.

9. To clean off particles that may be on the surface of the wafer press the start button and squirt a small amount of Acetone on the center of the wafer. It will spread and evaporate very quickly.

10. Obtain a plastic pipette for withdrawing photoresist from the container and to deposit it onto the wafer

11. Withdraw approximately 2 inches (or more if you are coating a 4 inch or larger wafer) of photoresist into the pipette.

12. Hold the pipette over the center of the wafer and press the start button.

13. Immediately squeeze the contents of the Photoresist onto the center of the wafer

14. When the spinning is finished, and stops, release the vacuum. Pick up the wafer using your fingers along the edges (wafer tweezers do not fit into the spinning area) and take it to the soft bake oven, put the wafer in the oven for 1 minute at 100C.

15. After 1 minute remove the wafer from the oven and allow it to cool. It is now ready to expose.

16. ALWAYS inspect the wafer under a microscope after exposure and develop to insure everything is correct. If the wafer does not look correct put it back on the spinner chuck and remove the photoresist pattern with Acetone. Use the same settings, press start and squirt Acetone onto the center of the wafer during the deposit speed and it will dry quickly during the spin speed. Redeposit photoresist, expose and develop if necessary.