The Micro/Nano Fabrication Center at the University of Arizona
 

 

Kulicke & Soffa Wafer Saw

The Kulicke and Soffa 780 dicing saw is a back-end processing tool for cutting wafers or substrates, typically silicon or quartz, into smaller pieces or chips for packaging or further processing. Some of the features of this tool are:

  • Integrated semi-automatic computer controlled precision saw. It is menu driven, with a multi-axis cutting stage with automatic indexing.
  • Employs an extremely thin diamond impregnated cutting wheel with water cooling. The two inch wheel is mounted on an air spindle which is driven at speeds up to 32,000 rpm.
  • The chuck accepts up to 6" diameter wafers.
  • Video monitor for online inspection and alignment.
  • Capable of cutting a wide variety of materials such as silicon, quartz, metal coated substrates, glass, ceramics and sapphire.

Cutting a Solar Cell

University of Arizona | College of Engineering | 1230 E. Speedway Blvd. | Tucson, AZ 85721-0104
Phone: 520-621-3380 | Fax: 520-621-8881 | contact us
 
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